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Efektywne połaczenia dają swobodę projektowania
With a wide range of “PUSH IN” PCB terminals designed for the SMD reflow soldering process, Weidmüller meets the requirements of practical application: from fully automatic surface mounting to the practical plug-in connections for installing devices.
WIN! With its proven OMNIMATE series, Weidmüller is a long-standing partner of device manufacturers. What trends in this field does the technology of the SMD reflow soldering procedure respond to?
Ude: Device production in the electronics segment is consistently geared towards achieving a high degree of efficiency. To this end, it is essential that connection elements can be processed with the component assembly as part of a fully automatic procedure in a single production process. Maximum freedom in device design also relies on space being available on the PCB and the assembly of different kinds of material. This is also an area which calls for SMD surface mounting, which is now being used for both active and passive components.
WIN! What properties of SMD soldering enable the space-saving and design freedom benefits that you mentioned?
Ude: One of the goals in having freedom of design during device development is to efficiently assemble printed circuit boards while
Jürgen Ude, a specialist for SMD technology at Weidmüller, explains the benefits of the expanded range of LSF-SMD products
ensuring a high level of quality. Handling benefits and time savings are especially important during the installation process. The use of SMD components frees up the rear of the PCB, which can then be used for attaching further components. In the best-case scenario, device manufacturers have twice the space available on their PCB – or they benefit from a circuit board that is only half the size so, ultimately, the complete device
Two soldering pads per pole ensure that the LSF-SMD has fantastic mechanical stability properties and – thanks to its material properties – the LCP insulating material used allows for direct assembly and processing within the fully automated reflow process
can be designed in a more compact fashion.
Other aspects include the assembly of different materials such as glass, ceramics or aluminium, which is influential in the development of LED illumination devices. This often involves the installation of aluminium heat sinks, which provides no possibility for drilled holes. In such cases, SMD technology is the ideal solution for attaching the necessary connection components.
WIN! What characterises the new OMNIMATE LSF-SMD product family from Weidmüller?
Ude: Depending on the scope of the application field,
we rely on a unique range of products. The LSF-SMD family expands our flexible product line of LSF-SMT components, which are suitable for reflow soldering, by meeting all of the requirements of fully automatic PCB surface mounting for three main grid dimensions and three conductor exit versions. In combination with its ubiquitous “PUSH IN” connection system, we are able to satisfy the demand for high efficiency – from circuit board assembly to the installation of ready-to-use devices.
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SMD soldering applications mainly range from industrial and building automation, over LED lighting, to infrastructure in the telecommunications sector. Read our application stories to find out more about how LSF-SMD PCB terminals from Weidmüller cut an impressive figure in practical use:
The best shaped functional integration
A large number of channels on the smallest PCB space characterises the compact design of the CPX-L I/O modules from Festo. But what lies behind this impressive feature? The “PUSH IN” LSF-SMD PCB terminals!
The benefits of the “PUSH IN” LSF-SMD PCB terminals score highly for the customer-specific stainless steel keyboards from lighting expert Abaled, which are used to control the RGB LED lighting.